TEMSCON Global 2025 is the flagship conference for the IEEE Technology and Engineering Management Society, bringing together researchers, practitioners, policy experts, students, and others to present and discuss new developments in management, innovation, and leadership across the spectrum of technology, science, and engineering.

The submission site for TEMSCON Global will open shortly; watch this space!

Submission
Deadline
January 15, 2025

Acceptance/Rejection Notice
March 31, 2025

Final Manuscript Submission
May 15, 2025